Chip stacking today is limited by thermal management. Can't stack multiple high TDP (e.g. logic) chips together, can only do one + low power chips (e.g. memory). Wonder if this is something DARPA is trying to solve here.
If we are thinking about world models and embodied AI as the next big wave, I feel we need to factor the size of this market across military and civilian applications. When I hear Tesla AI4-6 plans for autonomous driving and Optimus, Apple’s home robot, and many such initiatives, I’m also thinking of an autonomous military drone arms race and autonomous space exploration and moon colonization. Edge compute will be a key innovation and I feel Apple is gonna be best placed to exploit their power efficient M-series architectures.
Chip stacking today is limited by thermal management. Can't stack multiple high TDP (e.g. logic) chips together, can only do one + low power chips (e.g. memory). Wonder if this is something DARPA is trying to solve here.
Skywater Technology offers similar services as well. Competition is good but does the US risk funding too many subscale entities?
https://www.skywatertechnology.com/heterogeneous-integration...
The US will fund as many people who will develop this tech as need be. The national champion approach produces a too big to fail lazy company.
If we are thinking about world models and embodied AI as the next big wave, I feel we need to factor the size of this market across military and civilian applications. When I hear Tesla AI4-6 plans for autonomous driving and Optimus, Apple’s home robot, and many such initiatives, I’m also thinking of an autonomous military drone arms race and autonomous space exploration and moon colonization. Edge compute will be a key innovation and I feel Apple is gonna be best placed to exploit their power efficient M-series architectures.